Lauren A. Link

City:

Mesa, Arizona

Country:

United States

Published Applications:

Last publication date:

2022-03-03

Top Assignees for applications by Lauren A. Link

The entities that hold a legal rights for patent applications filed by inventor Link Lauren A.:

Lauren A. Link from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Coreless organic packages with embedded die and magnetic inductor structures

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL TO FORM INDUCTORS

Package substrate with reduced interconnect stress

SUBSTRATE FOR AN ELECTRONIC DEVICE

Coreless organic packages with embedded die and magnetic inductor structures

Coreless organic packages with embedded die and magnetic inductor structures

SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER

Plated through hole socketing coupled to a solder ball to engage with a pin

InventorID:

2558321 ⎘