CHIPMOS TECHNOLOGIES INC.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2013-07-18

Top Assignees for applications by CHIPMOS TECHNOLOGIES INC.

The entities that hold a legal rights for patent applications filed by inventor CHIPMOS TECHNOLOGIES INC.:

CHIPMOS TECHNOLOGIES INC. 4 Hsinchu, Taiwan

Recent patent applications by CHIPMOS TECHNOLOGIES INC.

CHIPMOS TECHNOLOGIES INC. from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-18

US20130181333A1

Electricity

Semiconductor package structure and manufacturing method thereof

#2 | 2013-06-13

US20130147037A1

Electricity

Semiconductor structure having no adjacent bumps between two adjacent pads

#3 | 2013-06-06

US20130140686A1

Electricity

Semiconductor package structure and manufacturing method thereof

#4 | 2013-05-23

US20130127047A1

Electricity

Conductive structure and method for forming the same

InventorID:

256414 ⎘