Sriram MUTHUKUMAR

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Integrated WLUF and SOD process

Integrated WLUF and SOD process

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Methods and apparatuses to stiffen integrated circuit package

Methods and apparatuses to stiffen integrated circuit package

Methods for making multi-chip packaging using an interposer

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Method of stiffening coreless package substrate

Metal-metal bonding of compliant interconnect

Method of stiffening coreless package substrate

Thin silicon based substrate

Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias

Multi-chip packaging using an interposer with through-vias

Electropolishing metal features on a semiconductor wafer

HIGH PERFORMANCE INTEGRATED INDUCTOR

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

Composite metal layer formed using metal nanocrystalline particles in an electroplating bath

Process for coating thick resist over polymer features

High performance integrated inductor

Offset solder bump method and apparatus

Thin silicon based substrate

Compliant interconnects for semiconductors and micromachines

Method of manufacturing of thin based substrate

Integrated inductors and compliant interconnects for semiconductor packaging

Metal-metal bonding of compliant interconnect

Compliant multi-composition interconnects