Suwon-si
South Korea
27
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor KIM Joonsung:
Joonsung KIM from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
#2 | 2026-01-08SEMICONDUCTOR PACKAGE
#3 | 2025-03-06SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#4 | 2025-02-27SEMICONDUCTOR PACKAGE
#5 | 2024-10-31SEMICONDUCTOR PACKAGE
#6 | 2024-07-18SEMICONDUCTOR PACKAGE
#7 | 2024-06-06SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
#8 | 2024-02-22SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#9 | 2024-02-01SEMICONDUCTOR PACKAGE
#10 | 2024-02-01SEMICONDUCTOR PACKAGE
#11 | 2024-01-25Semiconductor package
#12 | 2023-06-15Fan-out semiconductor package
#13 | 2023-05-25Fan-out semiconductor packages
#14 | 2023-02-23SEMICONDUCTOR PACKAGE
#15 | 2023-01-26SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#16 | 2022-12-08Semiconductor package
#17 | 2022-11-03RECOMBINANT VACCINIA VIRUS AND PHARMACEUTICAL COMPOSITION COMPRISING SAME
#18 | 2022-09-01Semiconductor packages
#19 | 2022-04-07Semiconductor package
#20 | 2022-03-03Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad
#21 | 2021-12-09Fan-out semiconductor package
#22 | 2021-07-01Semiconductor packages
#23 | 2021-06-17Fan-out semiconductor packages
#24 | 2020-05-21Fan-out semiconductor package
#25 | 2020-05-21Semiconductor package having semiconductor chip between first and second redistribution layers
#26 | 2019-08-22COMPOSITION FOR ALLEVIATING OR TREATING PAIN
#27 | 2012-06-28Method for manufacturing printed circuit board with optical waveguides
2590220 ⎘