Dublin, California
United States
14
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor Yang Bo:
Bo Yang from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTRONIC DEVICE ENCLOSURE HAVING A PLURALITY OF SURFACE FEATURES
#2 | 2025-12-25STORAGE DEVICE HEAT-MITIGATING ENCLOSURE
#3 | 2024-09-12SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
#4 | 2024-08-01Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces
#5 | 2024-07-25SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
#6 | 2023-12-07MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
#7 | 2023-12-07A DEVICE AND A METHOD OF MANUFACTURING A DEVICE, SUCH AS A LIQUID LENS, WITH BOND CONFIGURED TO FRACTURE AT THE SAME BURST PRESSURE
#8 | 2023-11-23Flip chip bump with multi-PI opening
#9 | 2023-11-23DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
#10 | 2023-10-26Protective enclosure for an electronic device
#11 | 2023-10-26Electronic device with heat transfer pedestal having optimized interface surface and associated methods
#12 | 2023-10-12Enclosure fitting for electronic device
#13 | 2021-12-09Semiconductor device package having cover portion with curved surface profile
#14 | 2020-01-02ASYMMETRIC GLASS LAMINATES
2600972 ⎘