Sameer Paital

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES

SILICON NITRIDE LAYER UNDER A COPPER PAD

SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING

METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS

THERMALLY CONDUCTIVE SLEEVES AROUND TGVS FOR IMPROVED HEAT DISSIPATION IN GLASS CORE SUBSTRATES OR GLASS INTERPOSERS

PROTECTIVE COATING ON AN EDGE OF A GLASS CORE

GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE

Substrate embedded magnetic core inductors and method of making

Lithographic cavity formation to enable EMIB bump pitch scaling

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures

Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages

Patternable die attach materials and processes for patterning

INTEGRATED CIRCUIT PACKAGE SUPPORTS HAVING INDUCTORS WITH MAGNETIC MATERIAL

Selective deposition of embedded thin-film resistors for semiconductor packaging

STRUCTURES WITHIN A SUBSTRATE LAYER TO CURE MAGNETIC PASTE

Substrate embedded magnetic core inductors and method of making

Lithographic cavity formation to enable EMIB bump pitch scaling

Thin film barrier seed metallization in magnetic-plugged through hole inductor