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Inventor profile of:

Lauren LINK

City:

Mesa, Arizona

Country:

United States

Published Applications:

2

Last publication date:

2020-12-17

Top Assignees for applications by Lauren LINK

The entities that hold a legal rights for patent applications filed by inventor LINK Lauren:

INTEL CORPORATION 2 Santa Clara, CA United States

Recent patent applications by LINK Lauren

Lauren LINK from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-12-17

US20200395282A1

Vias for package substrates

#2 | 2020-01-02

US20200006005A1

Patterning of thin film capacitors in organic substrate packages

InventorID:

2605367 ⎘