Mesa, Arizona
United States
17
2025-08-28
The entities that hold a legal rights for patent applications filed by inventor Heaton Thomas:
Thomas Heaton from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#2 | 2024-08-01PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
#3 | 2024-07-18COPPERLESS REGIONS TO CONTROL PLATING GROWTH
#4 | 2024-03-21THIN FILM CAPACITORS
#5 | 2023-10-26SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#6 | 2023-01-19Surface finishes with low RBTV for fine and mixed bump pitch architectures
#7 | 2022-06-23Electromigration resistant and profile consistent contact arrays
#8 | 2021-03-18COPPERLESS REGIONS TO CONTROL PLATING GROWTH
#9 | 2021-03-04SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
#10 | 2021-02-04SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
#11 | 2021-02-04Electromigration resistant and profile consistent contact arrays
#12 | 2021-01-21Corner guard for improved electroplated first level interconnect bump height range
#13 | 2021-01-21Protruding SN substrate features for epoxy flow control
#14 | 2020-04-30Surface finishes with low rBTV for fine and mixed bump pitch architectures
#15 | 2020-01-02MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
#16 | 2019-12-26Electromigration resistant and profile consistent contact arrays
#17 | 2019-10-01Electromigration resistant and profile consistent contact arrays
2605540 ⎘