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Inventor profile of:

Eiji Ishikawa

City:

Tokyo

Country:

Japan

Published Applications:

5

Last publication date:

2025-02-06

Top Assignees for applications by Eiji Ishikawa

The entities that hold a legal rights for patent applications filed by inventor Ishikawa Eiji:

  • DAI-ICHI HIGH FREQUENCY CO., LTD. 2 Tokyo, Japan
  • Ebara Environmental Plant Co., Ltd. 2 Tokyo, Japan
  • KABUSHIKI KAISHA YAKULT HONSHA 1 Tokyo, Japan
  • Ebara Corporation 1 Tokyo, Japan

Recent patent applications by Ishikawa Eiji

Eiji Ishikawa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-02-06
US20250040854A1
Human necessities

BRAIN WAVE MEASURING DEVICE AND BRAIN WAVE MEASURING METHOD

#2 | 2022-01-06
US20220002771A1
Chemistry; metallurgy

METHOD FOR PRODUCING SECRETED BETA-GALACTOSIDASE

#3 | 2021-07-08
US20210205878A1
Performing operations; transporting

Ni—Fe base alloy powder, and method for producing alloy coating using said Ni—Fe base alloy powder

#4 | 2020-01-16
US20200017949A1
Chemistry; metallurgy

Ni-based thermal spraying alloy powder and method for manufacturing alloy coating

#5 | 2011-06-23
US20110147050A1
Electricity

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

InventorID:

2615694 ⎘

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