Muenchen
Germany
9
2024-02-15
The entities that hold a legal rights for patent applications filed by inventor Stadler Michael:
Michael Stadler from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
#2 | 2023-12-28ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
#3 | 2023-04-06Segmented Leadframe for Flip Chip Attaching a Semiconductor Die Including Prevention of Die Tilt
#4 | 2023-03-30Semiconductor device having a metal clip with a solder volume balancing reservoir
#5 | 2022-07-28Metal clip with solder volume balancing reservoir
#6 | 2022-03-03Chip with chip pad and associated solder flux outgassing trench
#7 | 2021-11-18Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
#8 | 2020-05-14Semiconductor package and clip with a die attach
#9 | 2020-02-13SEMICONDUCTOR DEVICE COMPRISING A RECESS AND METHOD OF FABRICATING THE SAME
2645599 ⎘