Mesa, Arizona
United States
5
2026-03-19
The entities that hold a legal rights for patent applications filed by inventor Heaton Thomas S.:
Thomas S. Heaton from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS-CORE SUBSTRATE
#2 | 2025-12-11MICROELECTRONIC ASSEMBLIES HAVING A GLASS LAYER SUBSTRATE WITH INTEGRATED CAPACITORS
#3 | 2025-06-05MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES
#4 | 2024-07-04STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
#5 | 2020-02-27POCKET STRUCTURES, MATERIALS, AND METHODS FOR INTEGRATED CIRCUIT PACKAGE SUPPORTS
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