Tempe, Arizona
United States
16
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Lambert William J.:
William J. Lambert from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC) PACKAGE
#2 | 2024-06-20LAYER TRANSFER CLAMP FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY
#3 | 2023-03-30Conformal power delivery structure for direct chip attach architectures
#4 | 2023-03-30IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
#5 | 2023-03-30CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
#6 | 2023-03-30Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures
#7 | 2022-03-31High performance integrated RF passives using dual lithography process
#8 | 2022-03-24Multi-phase switching regulators with hybrid inductors and per phase frequency control
#9 | 2022-03-24Magnetic core inductors in interposer
#10 | 2022-03-24Package embedded magnetic power transformers for SMPS
#11 | 2021-12-30High-throughput additively manufactured power delivery vias and traces
#12 | 2021-07-29KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC) PACKAGE
#13 | 2021-02-04Reconfigurable inductor
#14 | 2020-06-25MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES
#15 | 2020-02-27Wirebond and leadframe magnetic inductors
#16 | 2009-11-12Transient voltage compensation system and method
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