Campbell, California
United States
19
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor LEI Wei:
Wei LEI from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PASSIVATING MICROWAVE DIELECTRICS FOR SEMICONDUCTOR MANUFACTURING
#2 | 2024-11-28Method for Metal Gapfill
#3 | 2024-06-13Interlayer for Resistivity Reduction in Metal Deposition Applications
#4 | 2024-05-02Buffer Layer for Dielectric Protection in Physical Vapor Deposition Metal Liner Applications
#5 | 2024-03-14Methods for forming metal gapfill with low resistivity
#6 | 2023-10-12SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER
#7 | 2023-05-04METHODS AND APPARATUS FOR TUNGSTEN GAP FILL
#8 | 2023-03-23Top magnets for decreased non-uniformity in PVD
#9 | 2023-01-26ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GAP FILL
#10 | 2022-12-01Methods for shaping magnetic fields during semiconductor processing
#11 | 2022-10-20METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUCTURES
#12 | 2022-10-13GAP FILL METHODS USING CATALYZED DEPOSITION
#13 | 2022-03-03Low resistivity tungsten film and method of manufacture
#14 | 2021-10-14Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill
#15 | 2021-10-14Selective deposition of titanium films
#16 | 2021-09-16GAP FILL METHODS USING CATALYZED DEPOSITION
#17 | 2020-05-07Methods and apparatus for controlling contact resistance in cobalt-titanium structures
#18 | 2020-05-07METHOD OF FORMING A COBALT LAYER ON A SUBSTRATE
#19 | 2020-03-05METHODS FOR SELECTIVE DEPOSITION USING MOLYBDENUM HEXACARBONYL
2662689 ⎘