Phoenix, Arizona
United States
31
2024-10-24
The entities that hold a legal rights for patent applications filed by inventor Bharath Krishna:
Krishna Bharath from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
#2 | 2023-12-07COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTRONIC COMPONENTS
#3 | 2023-06-15FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE
#4 | 2023-05-25POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECTRONIC ASSEMBLY
#5 | 2023-05-25STACKED MAGNETIC INDUCTOR AND METHOD
#6 | 2023-03-30Conformal power delivery structure for direct chip attach architectures
#7 | 2023-03-30IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
#8 | 2023-03-30CONFORMAL POWER DELIVERY STRUCTURES
#9 | 2023-03-30CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
#10 | 2023-03-30Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures
#11 | 2023-03-23IN-BUILT MAGNETIC INDUCTOR SCHEMES FOR GLASS CORE SUBSTRATES
#12 | 2023-03-02PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
#13 | 2023-03-02Packaging architecture for disaggregated integrated voltage regulators
#14 | 2022-12-22Microelectronic assemblies having an integrated voltage regulator chiplet
#15 | 2022-11-24MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND MAGNETIC CORE INDUCTORS
#16 | 2022-07-21Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line
#17 | 2022-03-31High performance integrated RF passives using dual lithography process
#18 | 2022-03-31STEPPED COAX MIL PTHS FOR MODULATING INDUCTANCE WITHIN A PACKAGE
#19 | 2022-03-24Multi-phase switching regulators with hybrid inductors and per phase frequency control
#20 | 2022-03-24STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRENT FLOW
#21 | 2022-03-24Microelectronic assemblies with inductors in direct bonding regions
#22 | 2022-03-24Magnetic core inductors in interposer
#23 | 2022-03-24Direct bonding in microelectronic assemblies
#24 | 2022-03-24Package embedded magnetic power transformers for SMPS
#25 | 2021-06-24Electrostatic discharge protection in integrated circuits
#26 | 2021-06-17ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY
#27 | 2021-04-08Coaxial magnetic inductors with pre-fabricated ferrite cores
#28 | 2020-04-02Microelectronic assemblies having an integrated voltage regulator chiplet
#29 | 2020-03-26Dies with integrated voltage regulators
#30 | 2020-03-26Microelectronic assemblies having magnetic core inductors
#31 | 2020-03-19INTEGRATED CIRCUIT PACKAGE SUPPORTS HAVING INDUCTORS WITH MAGNETIC MATERIAL
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