Munich
Germany
4
2023-10-05
The entities that hold a legal rights for patent applications filed by inventor O'SULLIVAN David:
David O'SULLIVAN from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
#2 | 2020-03-26NOVEL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP), FLIP-CHIP CHIP SCALE PACKAGE (FCCSP), AND FAN OUT SHIELDING CONCEPTS
#3 | 2019-11-21Fan out package-on-package with adhesive die attach
#4 | 2019-10-10Fan out packaging pop mechanical attach method
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