San Jose, California
United States
13
2016-03-24
The entities that hold a legal rights for patent applications filed by inventor Wang Wei D.:
Wei D. Wang from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Apparatus and method for depositing electronically conductive pasting material
#2 | 2014-02-13Low resistivity tungsten PVD with enhanced ionization and RF power coupling
#3 | 2013-06-06USE OF A1 BARRIER LAYER TO PRODUCE HIGH HAZE ZNO FILMS ON GLASS SUBSTRATES
#4 | 2011-12-15Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming
#5 | 2010-12-30Krypton sputtering of low resistivity tungsten
#6 | 2009-08-27Process for selective growth of films during ECP plating
#7 | 2009-06-04Apparatus and method for depositing electrically conductive pasting material
#8 | 2009-02-26Krypton sputtering of thin tungsten layer for integrated circuits
#9 | 2007-03-15Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
#10 | 2006-11-09Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
#11 | 2005-05-31Partially filling copper seed layer
#12 | 2005-04-26Diffusion enhanced ion plating for copper fill
#13 | 2005-01-04Asymmetric rotating sidewall magnet ring for magnetron sputtering
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