Norbert Mais

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2020-07-16

Top Assignees for applications by Norbert Mais

The entities that hold a legal rights for patent applications filed by inventor Mais Norbert:

Norbert Mais from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

Barrier for power metallization in semiconductor devices

InventorID:

2697869 ⎘