Inventor profile of:

Boon Teik Chan

City:

Wilsele

Country:

Belgium

Published Applications:

54

Last publication date:

2026-06-18

Top Assignees for applications by Boon Teik Chan

The entities that hold a legal rights for patent applications filed by inventor Chan Boon Teik:

Recent patent applications by Chan Boon Teik

Boon Teik Chan from Wilsele, BE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-18
US20260173481A1
Electricity

Method for Forming a Semiconductor Device

#2 | 2026-04-23
US20260114031A1
Electricity

Co-integrated Semiconductor Structure, and a Method for Manufacturing a Co-integrated Semiconductor Structure

#3 | 2025-11-13
US20250351468A1
Electricity

Method for Contacting the Gates of a Spin Qubit Gate Array

#4 | 2025-10-02
US20250311444A1
Electricity

SEMICONDUCTOR DEVICES INCLUDING PIN DIODES AND METHODS OF FORMING THE SAME

#5 | 2025-06-26
US20250212495A1
Electricity

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

#6 | 2025-06-26
US20250212494A1
Electricity

Method for Forming a Semiconductor Structure

#7 | 2025-04-24
US20250133815A1
Electricity

Method for Processing a CFET Device with Non-conformal Gate Dielectric

#8 | 2025-04-03
US20250113601A1
Electricity

COMPLEMENTARY FIELD EFFECT TRANSISTOR DEVICES AND METHODS OF PROCESSING THE SAME

#9 | 2025-03-27
US20250107199A1
Electricity

Method for Forming a Self-aligned Buried Power Rail in a Nanosheet-based Transistor Device

#10 | 2025-03-13
US20250087643A1
Electricity

Semiconductor Device and a Method for Forming a Semiconductor Device

#11 | 2024-11-07
US20240373617A1
Electricity

HIGH PERFORMANCE AND LOW POWER THREE-DIMENSIONAL STATIC RANDOM ACCESS MEMORY AND METHOD OF FORMING SAME

#12 | 2024-08-29
US20240290660A1
Electricity

INTEGRATED CIRCUIT CHIPS COMPRISING FORKSHEET DEVICES CONNECTED WITH BURIED POWER RAILS

#13 | 2024-07-11
US20240234207A9
Electricity

METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN BODY

#14 | 2024-06-27
US20240213312A1
Electricity

Integrated Circuit Devices and Methods for Making Such Devices

#15 | 2024-06-20
US20240206145A1
Electricity

Stacked SRAM Cell with a Dual-Side Interconnect Structure

#16 | 2024-06-20
US20240204082A1
Electricity

Method for Forming a Semiconductor Device

#17 | 2024-06-20
US20240204081A1
Electricity

METHOD FOR FORMING A SEMICONDUCTOR DEVICE

#18 | 2024-06-20
US20240204080A1
Electricity

METHOD FOR FORMING A SEMICONDUCTOR DEVICE

#19 | 2024-05-09
US20240154006A1
Electricity

METHOD FOR FORMING A SEMICONDUCTOR DEVICE

#20 | 2024-04-25
US20240136225A1
Electricity

METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN BODY

#21 | 2024-01-04
US20240006228A1
Electricity

Method for forming a buried metal line in a semiconductor substrate

#22 | 2023-12-21
US20230413505A1
Electricity

Bit Cell with Isolating Wall

#23 | 2023-12-21
US20230413504A1
Electricity

Bit Cell for Static Random Access Memory

#24 | 2023-11-30
US20230386928A1
Electricity

Method for Forming a Stacked Transistor Device

#25 | 2023-11-09
US20230361205A1
Electricity

Circuit cell for a standard cell semiconductor device

#26 | 2023-06-22
US20230197831A1
Electricity

Method for Forming a Semiconductor Device

#27 | 2023-06-22
US20230197830A1
Electricity

Method for Forming a Stacked FET Device

#28 | 2023-06-22
US20230197726A1
Electricity

Method for Forming a Stacked FET Device

#29 | 2023-06-22
US20230197528A1
Electricity

VIA FORMATION IN AN INTEGRATED CIRCUIT

#30 | 2023-06-22
US20230197525A1
Electricity

Method for Forming a Semiconductor Device Structure

#31 | 2023-06-22
US20230197522A1
Electricity

Method for Forming a Semiconductor Device

#32 | 2023-06-08
US20230178635A1
Electricity

METHOD FOR FORMING A FET DEVICE

#33 | 2023-06-08
US20230178630A1
Electricity

METHOD FOR FORMING A FET DEVICE

#34 | 2023-06-08
US20230178629A1
Electricity

METHOD FOR FORMING A FET DEVICE

#35 | 2022-06-23
US20220199809A1
Electricity

FET device and a method for forming a FET device

#36 | 2022-04-21
US20220122895A1
Electricity

Method for forming a semiconductor device and a semiconductor device

#37 | 2022-03-24
US20220093734A1
Electricity

Method for forming a semiconductor device

#38 | 2022-03-17
US20220084822A1
Electricity

Gate spacer patterning

#39 | 2022-03-03
US20220068725A1
Electricity

Method for forming transistor structures

#40 | 2021-12-16
US20210391526A1
Electricity

Method for processing a semiconductor device with two closely spaced gates

#41 | 2021-09-30
US20210305412A1
Electricity

Method for processing a FinFET device

#42 | 2021-09-23
US20210296500A1
Electricity

Method for filling a space in a semiconductor

#43 | 2021-06-24
US20210193510A1
Electricity

Methods of semiconductor device processing

#44 | 2021-06-10
US20210175130A1
Electricity

Isolated semiconductor layer stacks for a semiconductor device

#45 | 2021-04-29
US20210126108A1
Electricity

Method for producing self-aligned gate and source/drain via connections for contacting a FET transistor

#46 | 2021-04-22
US20210118747A1
Electricity

Split replacement metal gate integration

#47 | 2021-03-04
US20210066116A1
Electricity

Contact isolation in semiconductor devices

#48 | 2021-02-04
US20210035860A1
Electricity

Method for forming a buried metal line

#49 | 2021-01-28
US20210028059A1
Electricity

Method for Forming a Buried Metal Line in a Semiconductor Substrate

#50 | 2021-01-21
US20210020516A1
Electricity

Self-aligned layer patterning

#51 | 2020-10-15
US20200328122A1
Electricity

Method of forming a mask layer

#52 | 2020-05-28
US20200168606A1
Electricity

Method of fabricating stacked semiconductor device

#53 | 2020-05-07
US20200144094A1
Electricity

Removing an organic sacrificial material from a two-dimensional material

#54 | 2020-04-09
US20200111892A1
Electricity

PROCESS OF FORMING A GATE OF A SEMICONDUCTOR DEVICE

InventorID:

2697950 ⎘