Teublitz
Germany
15
2024-03-14
The entities that hold a legal rights for patent applications filed by inventor Roesl Konrad:
Konrad Roesl from Teublitz, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Electronic device with multi-layer contact and system
#2 | 2023-04-27Semiconductor device having a soldered joint with one or more intermetallic phases
#3 | 2021-12-02ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF A SEMICONDUCTOR DIE AND A METAL REGION OF A SUBSTRATE
#4 | 2021-05-13Batch diffusion soldering and electronic devices produced by batch diffusion soldering
#5 | 2021-05-13Preform diffusion soldering
#6 | 2020-03-05Electronic device with multi-layer contact and system
#7 | 2019-01-03Method for producing electronic device with multi-layer contact
#8 | 2017-01-26Electronic Device with Multi-Layer Contact
#9 | 2016-02-11Batch process for connecting chips to a carrier
#10 | 2014-11-06Method for mounting a semiconductor chip on a carrier
#11 | 2014-06-26Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
#12 | 2013-06-06Electronic device with multi-layer contact
#13 | 2012-08-16Method for mounting a semiconductor chip on a carrier
#14 | 2007-06-14Method for the planar joining of components of semiconductor devices and a diffusion joining structure
#15 | 2007-04-26Semiconductor device and method for producing the same
270469 ⎘