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Inventor profile of:

Do-Sun LEE

City:

Gwangju

Country:

South Korea

Published Applications:

6

Last publication date:

2014-08-07

Top Assignees for applications by Do-Sun LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Do-Sun:

  • Samsung Electronics Co., Ltd 4 , South Korea
  • SAMSUNG ELECTRONICS CO., LTD. 3 Suwon-si, South Korea
  • Samsung Electronics Co., Ltd. 1 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, South Korea

Recent patent applications by LEE Do-Sun

Do-Sun LEE from Gwangju, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-08-07
US20140217559A1
Electricity

Semiconductor devices having through silicon vias and methods of fabricating the same

#2 | 2014-05-22
US20140138819A1
Electricity

SEMICONDUCTOR DEVICE INCLUDING TSV AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

#3 | 2014-01-23
US20140021633A1
Electricity

Integrated circuit device having through-silicon-via structure

#4 | 2013-06-06
US20130140697A1
Electricity

Electrode connecting structures containing copper

#5 | 2013-05-16
US20130119547A1
Electricity

Integrated circuit device including through-silicon via structure having offset interface

#6 | 2012-11-08
US20120282736A1
Electricity

Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same

InventorID:

270486 ⎘

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