Albany, New York
United States
18
2025-12-25
The entities that hold a legal rights for patent applications filed by inventor deVilliers Anton:
Anton deVilliers from Albany, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER OVERLAY REGISTRATION IN HYBRID BONDING
#2 | 2025-10-02DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACTLESS DIE SHAPE CONTROL
#3 | 2025-10-02DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL
#4 | 2025-10-02USING LASER BASED SYSTEM FOR MEAN OF SHAPING OF UNSINGULATED & SINGULATED DIES BY SUBSTRATE LATTICE MANIPULATION
#5 | 2025-10-02PATTERNING A SUBSTRATE USING A MULTI-PATTERNING TECHNIQUE
#6 | 2025-09-11Wet Processing Systems Having Novel Wafer Chuck Designs For Retaining A Processing Liquid On A Surface Of A Semiconductor Substrate
#7 | 2025-09-11Novel Wafer Chuck Designs And Methods For Retaining A Processing Liquid On A Surface Of A Semiconductor Wafer
#8 | 2025-04-17DEVICE AND METHOD FOR DETERMINING WAFER BOW
#9 | 2025-02-27CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
#10 | 2024-08-29METHOD FOR CELL LAYOUT
#11 | 2024-06-20APPARATUS AND METHOD FOR WAFER ALIGNMENT
#12 | 2021-08-05EFFICIENT THREE-DIMENSIONAL DESIGN FOR LOGIC APPLICATIONS USING VARIABLE VOLTAGE THRESHOLD THREE-DIMENSIONAL CMOS DEVICES
#13 | 2021-08-05Multiple patterning processes
#14 | 2021-04-01Reverse contact and silicide process for three-dimensional semiconductor devices
#15 | 2021-02-04Method and process for forming memory hole patterns
#16 | 2020-05-14Method for forming and using stress-tuned silicon oxide films in semiconductor device patterning
#17 | 2019-09-19Critical dimension correction via calibrated trim dosing
#18 | 2018-11-29Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor wafer
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