JAN HOFFMANN

City:

Michendorf

Country:

Germany

Published Applications:

Last publication date:

2024-04-04

Top Assignees for applications by JAN HOFFMANN

The entities that hold a legal rights for patent applications filed by inventor HOFFMANN JAN:

JAN HOFFMANN from Michendorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Laser-Assisted Soldering Apparatus

Laser-assisted Soldering Apparatus and Solder Deposition Machine

Method and device for establishing a wire connection as well as a component arrangement having a wire connection

InventorID:

2740329 ⎘