Munich
Germany
12
2024-02-15
The entities that hold a legal rights for patent applications filed by inventor Stadler Michael:
Michael Stadler from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of soldering a semiconductor chip to a chip carrier
#2 | 2023-12-28ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
#3 | 2023-03-30Semiconductor device having a metal clip with a solder volume balancing reservoir
#4 | 2022-07-28Metal clip with solder volume balancing reservoir
#5 | 2022-07-07Semiconductor arrangement and method for producing a semiconductor arrangement
#6 | 2022-03-03Chip with chip pad and associated solder flux outgassing trench
#7 | 2021-11-18Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
#8 | 2021-07-29Electrical interconnect structure with radial spokes for improved solder void control
#9 | 2020-08-20Semiconductor arrangement and method for producing a semiconductor arrangement
#10 | 2020-06-11Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package
#11 | 2020-05-28Semiconductor device and method for fabricating a semiconductor device
#12 | 2020-05-14Semiconductor package and clip with a die attach
2746650 ⎘