Suwon-si
South Korea
17
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor Lee Jaeean:
Jaeean Lee from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE
#2 | 2026-03-05SEMICONDUCTOR PACKAGE
#3 | 2025-12-11SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4 | 2025-05-01INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#5 | 2025-04-17PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUFACTURING THE SAME
#6 | 2025-03-06SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#7 | 2025-03-06SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
#8 | 2025-02-20SEMICONDUCTOR PACKAGE
#9 | 2025-01-09SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#10 | 2024-10-17SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#11 | 2024-09-12SEMICONDUCTOR PACKAGE
#12 | 2024-02-22SEMICONDUCTOR PACKAGE
#13 | 2022-12-01SEMICONDUCTOR PACKAGE
#14 | 2022-05-26Semiconductor package including under bump metallization pad
#15 | 2021-11-25Interposer and semiconductor package including the same
#16 | 2021-06-17Semiconductor package and method of manufacturing the same
#17 | 2020-06-11Interposer and semiconductor package including the same
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