Min-Tih LAI

City:

Bothell, Washington

Country:

United States

Published Applications:

Last publication date:

2024-11-14

Top Assignees for applications by Min-Tih LAI

The entities that hold a legal rights for patent applications filed by inventor LAI Min-Tih:

Min-Tih LAI from Bothell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

SYSTEMS AND METHODS FOR IMPROVING INTERACTIONS WITH ARTIFICIAL INTELLIGENCE MODELS

SYSTEMS AND METHODS FOR IMPROVING INTERACTIONS WITH ARTIFICIAL INTELLIGENCE MODELS

Shrinkable package assembly

InventorID:

2768349 ⎘