Tokyo
Japan
8
2021-09-16
The entities that hold a legal rights for patent applications filed by inventor Takayanagi Hideki:
Hideki Takayanagi from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium
#2 | 2020-06-25Method of removing liquid from seal of a substrate holder
#3 | 2019-12-26Substrate holder and plating apparatus
#4 | 2009-03-05Substrate holding apparatus
#5 | 2007-01-02Substrate polishing machine
#6 | 2006-10-19Substrate holding apparatus
#7 | 2005-06-02Substrate holding apparatus
#8 | 2005-02-08Substrate holding apparatus
2772917 ⎘