Durham, North Carolina
United States
6
2024-03-07
The entities that hold a legal rights for patent applications filed by inventor Cohen Erwin:
Erwin Cohen from Durham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS OF IMPLEMENTING THE SAME
#2 | 2023-07-06Limiting failures caused by dendrite growth on semiconductor chips
#3 | 2021-11-11Packaged transistor having die attach materials with channels and process of implementing the same
#4 | 2021-11-11Integrated circuit having die attach materials with channels and process of implementing the same
#5 | 2020-10-08Robust electronics mounting device
#6 | 2020-06-25Robust integrated circuit package
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