Shinsuke TEI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-01-04

Top Assignees for applications by Shinsuke TEI

The entities that hold a legal rights for patent applications filed by inventor TEI Shinsuke:

SHINKAWA LTD. 10 Tokyo, Japan

Recent patent applications by TEI Shinsuke

Shinsuke TEI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-01-04

US20240006193A1

Electricity

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

#2 | 2023-09-07

US20230282613A1

Electricity

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS

#3 | 2023-05-25

US20230163097A1

Electricity

Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program

#4 | 2022-10-13

US20220328450A1

Electricity

Wire bonding apparatus and method for manufacturing semiconductor device

#5 | 2022-06-30

US20220208721A1

Electricity

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#6 | 2020-06-25

US20200203307A1

Electricity

Wire bonding apparatus and manufacturing method for semiconductor apparatus

#7 | 2012-06-07

US20120139129A1

Electricity

Wire bonding method and semiconductor device

#8 | 2012-03-08

US20120055976A1

Electricity

Method of manufacturing semiconductor device and wire bonding apparatus

#9 | 2011-11-17

US20110278349A1

Electricity

Wire bonding apparatus and wire bonding method

#10 | 2011-07-28

US20110180590A1

Electricity

Method of manufacturing semiconductor device and wire bonding apparatus

InventorID:

2776069 ⎘