Johannes Lodermeyer

City:

Regensburg

Country:

Germany

Published Applications:

Last publication date:

2015-07-09

Top Assignees for applications by Johannes Lodermeyer

The entities that hold a legal rights for patent applications filed by inventor Lodermeyer Johannes:

INFINEON TECHNOLOGIES AG 3 Neubiberg, Germany
INFINEON TECHNOLOGIES AUSTRIA AG 1 Villach, Austria

Recent patent applications by Lodermeyer Johannes

Johannes Lodermeyer from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-07-09

US20150194362A1

Electricity

Chip-embedded packages with backside die connection

#2 | 2015-06-04

US20150155271A1

Electricity

Device including two power semiconductor chips and manufacturing thereof

#3 | 2013-06-13

US20130146991A1

Electricity

Device including two power semiconductor chips and manufacturing thereof

#4 | 2010-03-11

US20100059857A1

Electricity

Method of fabricating a semiconductor device

InventorID:

281845 ⎘