Rottenburg
Germany
15
2024-11-07
The entities that hold a legal rights for patent applications filed by inventor Rogalli Michael:
Michael Rogalli from Rottenburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
#2 | 2023-12-07Chip package and method of forming a chip package
#3 | 2021-12-02Chip package and method of forming a chip package
#4 | 2020-02-06Adhesion Enhancing Structures for a Package
#5 | 2018-12-20Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#6 | 2017-08-17Semiconductor devices and processing methods
#7 | 2016-11-10Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
#8 | 2015-12-10Method for providing a self-aligned pad protection in a semiconductor device
#9 | 2015-06-25Method for providing a self-aligned pad protection in a semiconductor device
#10 | 2014-04-24SEMICONDUCTOR DEVICES AND PROCESSING METHODS
#11 | 2013-06-13Integrated circuit and method of forming an integrated circuit
#12 | 2008-01-10Sensor device and a method for its manufacturing
#13 | 2005-10-25Process for the back-surface grinding of wafers
#14 | 2005-06-16Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask
#15 | 2005-04-28Method for the production of a semiconductor device
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