Kumar Singh

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2020-08-27

Top Assignees for applications by Kumar Singh

The entities that hold a legal rights for patent applications filed by inventor Singh Kumar:

Kumar Singh from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE

Coupled cooling fins in ultra-small systems

CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT REDUCTION

InventorID:

2835023 ⎘