Daniel J. Hoffman

City:

Country:

United States

Published Applications:

Last publication date:

2013-01-03

Top Assignees for applications by Daniel J. Hoffman

The entities that hold a legal rights for patent applications filed by inventor Hoffman Daniel J.:

Daniel J. Hoffman from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Projected plasma source

High density plasma gapfill deposition-etch-deposition process etchant

InventorID:

2860 ⎘