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Inventor profile of:

JA EUNG KOO

City:

SUWON-SI

Country:

South Korea

Published Applications:

6

Last publication date:

2020-09-24

Top Assignees for applications by JA EUNG KOO

The entities that hold a legal rights for patent applications filed by inventor KOO JA EUNG:

  • SAMSUNG ELECTRONICS CO., LTD. 1 Suwon-si, South Korea
  • SAMSUNG ELECTRONICS CO., LTD. 1 Gyeonggi-Do, South Korea

Recent patent applications by KOO JA EUNG

JA EUNG KOO from SUWON-SI, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-09-24
US20200303218A1
Electricity

Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment

#2 | 2008-04-03
US20080081406A1
Electricity

Method of Fabricating Semiconductor Device Having Dual Stress Liner

#3 | 2008-02-21
US20080045018A1
Electricity

Method of chemical-mechanical polishing and method of forming isolation layer using the same

#4 | 2007-11-15
US20070262393A1
Electricity

Method of forming the semiconductor device

#5 | 2007-08-02
US20070178644A1
Electricity

Semiconductor device having an insulating layer and method of fabricating the same

#6 | 2007-06-07
US20070128991A1
Performing operations; transporting

Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same

InventorID:

2860026 ⎘

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