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Inventor profile of:

Daniel Lee

City:

Tenafly, New Jersey

Country:

United States

Published Applications:

5

Last publication date:

2023-10-19

Top Assignees for applications by Daniel Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Daniel:

  • SAMSUNG ELECTRONICS CO., LTD. 5 Suwon-si, South Korea

Recent patent applications by Lee Daniel

Daniel Lee from Tenafly, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-19
US20230330873A1
Performing operations; transporting

METHOD AND APPARATUS FOR PROXIMITY DETECTION AND PROXIMITY DIRECTION ESTIMATION

#2 | 2021-06-03
US20210166470A1
Physics

Higher-order function networks for learning composable three-dimensional (3D) object and operating method thereof

#3 | 2021-02-11
US20210039884A1
Performing operations; transporting

METHOD AND APPARATUS FOR OPERATING AN AUTOMATIC STORAGE SYSTEM

#4 | 2021-01-07
US20210005013A1
Physics

Higher-order function networks for learning composable three-dimensional (3D) object and operating method thereof

#5 | 2020-10-01
US20200311969A1
Physics

Method and apparatus for estimating tool trajectories

InventorID:

2867406 ⎘

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