Sinking Spring, Pennsylvania
United States
10
2015-07-30
The entities that hold a legal rights for patent applications filed by inventor Bachman Mark A.:
Mark A. Bachman from Sinking Spring, US has applied for patents for these inventions. The list has both pending applications and granted patents:
STACKED INTERCONNECT HEAT SINK
#2 | 2014-08-07Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
#3 | 2014-01-16CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
#4 | 2013-10-24Stacked interconnect heat sink
#5 | 2013-06-13Solder interconnect by addition of copper
#6 | 2012-01-26Stacked interconnect heat sink
#7 | 2011-08-11Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#8 | 2011-01-13Solder interconnect by addition of copper
#9 | 2011-01-13SUPPRESSING FRACTURES IN DICED INTEGRATED CIRCUITS
#10 | 2007-03-29Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
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