Albany, New York
United States
8
2025-10-02
The entities that hold a legal rights for patent applications filed by inventor SCHEPIS Anthony:
Anthony SCHEPIS from Albany, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACTLESS DIE SHAPE CONTROL
#2 | 2025-10-02DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL
#3 | 2024-06-20APPARATUS AND METHOD FOR WAFER ALIGNMENT
#4 | 2023-11-16Method of patterning a substrate using a sidewall spacer etch mask
#5 | 2021-11-11Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
#6 | 2021-03-25Method of patterning a substrate using a sidewall spacer etch mask
#7 | 2020-10-15Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
#8 | 2020-10-15METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEMICONDUCTOR DEVICES
2881085 ⎘