Poh Boon Khoo

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

Package Substrates with Stiffener Interposers

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE

INTERPOSER POWER CORRIDOR

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPER SPREADER COMPONENT

MOLDED INTERCONNECT MEMORY ON PACKAGE

METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCHITECTURES

INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge

Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages

Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge