Gilbert, Arizona
United States
43
2026-03-26
The entities that hold a legal rights for patent applications filed by inventor Arrington Kyle:
Kyle Arrington from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
3D PRINTING OF GLASS CORE EDGE PROTECTION IN IC DEVICE PACKAGING
#2 | 2026-03-26EDGE COATING FOR GLASS CORE SUBSTRATE WITH A FRAME
#3 | 2026-03-26EDGE COATING FOR GLASS CORE SUBSTRATE WITH AIR PRESSING FOR PROFILE CONTROL
#4 | 2026-03-26GLASS CORE SUBSTRATE WITH EDGE BIAS
#5 | 2025-07-03FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWALL FILLING
#6 | 2025-07-03DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES
#7 | 2025-07-03PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE THICKNESS
#8 | 2025-07-03LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
#9 | 2025-07-03RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
#10 | 2025-06-12EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
#11 | 2025-06-12ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
#12 | 2025-06-05DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
#13 | 2025-04-03CONTROLLING SUBSTRATE BUMP HEIGHT
#14 | 2025-04-03GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
#15 | 2025-04-03APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
#16 | 2025-03-27STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
#17 | 2024-10-032D FILLERS FOR REDUCED CTE FOR PID
#18 | 2024-09-19METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
#19 | 2024-08-22Enhanced base die heat path using through-silicon vias
#20 | 2024-08-15CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CONTAINERS, AND METHODS
#21 | 2024-08-08LIGHT RESPONSIVE PHOTORESISTS AND METHODS
#22 | 2024-07-04DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
#23 | 2024-07-04METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES
#24 | 2024-07-04METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES
#25 | 2024-07-04METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS
#26 | 2024-06-27METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES
#27 | 2024-04-04SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
#28 | 2024-02-29THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
#29 | 2023-10-05METAL PCB FOR TOPSIDE POWER DELIVERY
#30 | 2023-09-14SINGULATED DIE SHIPPING TRAY ASSEMBLY
#31 | 2023-06-29LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
#32 | 2023-04-27Enhanced base die heat path using through-silicon vias
#33 | 2022-06-23Immersion cooling for integrated circuit devices
#34 | 2022-06-23GALLIUM ALLOYS AS FILLERS FOR POLYMER THERMAL INTERFACE MATERIALS
#35 | 2021-12-16Low force liquid metal interconnect solutions
#36 | 2021-10-21Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material
#37 | 2021-09-02INTERPOSER HEAT SPREADER
#38 | 2021-08-19Enhanced base die heat path using through-silicon vias
#39 | 2021-08-05Printed heat spreader structures and methods of providing same
#40 | 2021-07-22First-level integration of second-level thermal interface material for integrated circuit assemblies
#41 | 2021-07-01IC assemblies including die perimeter frames suitable for containing thermal interface materials
#42 | 2021-06-24Full package vapor chamber with IHS
#43 | 2020-11-05Integrated heat spreader with enhanced vapor chamber for multichip packages
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