Daeho LEE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2026-01-29

Top Assignees for applications by Daeho LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Daeho:

Daeho LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

CHIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF IMAGE STABILIZATION AND ELECTRONIC DEVICE PERFORMING THE SAME

IMAGE PROCESSOR AND IMAGE PROCESSING SYSTEM INCLUDING THE SAME

IMAGE SIGNAL PROCESSOR AND METHOD OF PROCESSING IMAGES

SEMICONDUCTOR PACKAGE

METHOD FOR PROVIDING GUIDE INFORMATION ASSOCIATED WITH ARTIFACTS AND MAGNETIC RESONANCE IMAGING DEVICE THEREFOR

InventorID:

2928213 ⎘