Daniel Obermeier

City:

Ensdorf

Country:

Germany

Published Applications:

Last publication date:

2024-12-05

Top Assignees for applications by Daniel Obermeier

The entities that hold a legal rights for patent applications filed by inventor Obermeier Daniel:

Daniel Obermeier from Ensdorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICALLY WELDED CONTACT REGIONS AND METHOD OF PRODUCING THE POWER SEMICONDUCTOR MODULE

Semiconductor package and method for fabricating a semiconductor package

InventorID:

2939217 ⎘