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Inventor profile of:

Eunnara Cho

City:

Seoul

Country:

South Korea

Published Applications:

Last publication date:

2024-10-03

Top Assignees for applications by Eunnara Cho

The entities that hold a legal rights for patent applications filed by inventor Cho Eunnara:

Amkor Technology Singapore Holding Pte. Ltd. 4 Singapore, Singapore
AMKOR TECHNOLOGY, INC. 3 Tempe, AZ United States
AMKOR TECHNOLOGY, INC. 1 Chandler, AZ United States
Amkor Technology, Inc. 1 Temp, AZ United States

Recent patent applications by Cho Eunnara

Eunnara Cho from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-03

US20240332159A1

Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

#2 | 2023-08-17

US20230257257A1

Performing operations; transporting

Semiconductor package using a polymer substrate

#3 | 2022-02-17

US20220051973A1

Electricity

Semiconductor package and manufacturing method thereof

#4 | 2021-02-18

US20210047172A1

Performing operations; transporting

Semiconductor package using a polymer substrate

#5 | 2019-05-23

US20190152770A1

Performing operations; transporting

Semiconductor package using a polymer substrate

#6 | 2018-12-06

US20180350734A1

Electricity

Semiconductor package and manufacturing method thereof

#7 | 2018-05-17

US20180134546A1

Performing operations; transporting

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#8 | 2018-03-01

US20180057353A1

Performing operations; transporting

Semiconductor package and manufacturing method thereof

#9 | 2017-11-09

US20170320723A1

Performing operations; transporting

Semiconductor package and manufacturing method thereof

#10 | 2017-01-19

US20170018493A1

Electricity

Semiconductor package and manufacturing method thereof

#11 | 2016-08-04

US20160221820A1

Performing operations; transporting

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

#12 | 2015-10-01

US20150274511A1

Performing operations; transporting

Semiconductor Package And Manufacturing Method Thereof

#13 | 2014-01-16

US20140017843A1

Performing operations; transporting

Semiconductor package and manufacturing method thereof

#14 | 2013-06-20

US20130154066A1

Electricity

Semiconductor package and manufacturing method thereof

InventorID:

294433 ⎘