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Inventor profile of:

WonIl Kwon

City:

Seoul

Country:

South Korea

Published Applications:

5

Last publication date:

2014-03-13

Top Assignees for applications by WonIl Kwon

The entities that hold a legal rights for patent applications filed by inventor Kwon WonIl:

  • STATS CHIPPAC, LTD. 5 Singapore, Singapore
  • STATS ChipPAC Pte Ltd. 2 Singapore, Singapore

Recent patent applications by Kwon WonIl

WonIl Kwon from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-03-13
US20140070410A1
Electricity

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

#2 | 2013-12-05
US20130320519A1
Electricity

Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces

#3 | 2013-11-14
US20130300004A1
Electricity

Semiconductor device and method of controlling warpage in semiconductor package

#4 | 2013-06-20
US20130154107A1
Electricity

Integrated circuit packaging system with coupling features and method of manufacture thereof

#5 | 2012-08-23
US20120211900A1
Electricity

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

InventorID:

294506 ⎘

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