Leuven
Belgium
43
2025-04-17
The entities that hold a legal rights for patent applications filed by inventor Beyne Eric:
Eric Beyne from Leuven, BE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PRODUCT
#2 | 2022-06-16METHOD AND SYSTEM TO PRODUCE DIES FOR A WAFER RECONSTITUTION
#3 | 2017-07-06MIMCAP structure in a semiconductor device package
#4 | 2017-06-29Method for aligning micro-electronic components
#5 | 2017-01-05Method for bonding and interconnecting integrated circuit devices
#6 | 2016-06-02MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE
#7 | 2015-10-22Biocompatible packaging
#8 | 2015-09-03Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
#9 | 2015-06-25Method for aligning micro-electronic components
#10 | 2015-02-05Semiconductor device having through-substrate vias
#11 | 2014-12-25Method for producing contact areas on a semiconductor substrate
#12 | 2014-06-05MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE
#13 | 2013-09-12METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
#14 | 2013-06-20Method for Forming Isolation Trenches in Micro-Bump Interconnect Structures and Devices Obtained Thereof
#15 | 2012-12-13Method for detecting embedded voids in a semiconductor substrate
#16 | 2012-11-08Window interposed die packaging
#17 | 2012-08-16Biocompatible packaging
#18 | 2012-06-07Method for forming isolation trenches
#19 | 2012-01-19Method for forming 3D-interconnect structures with airgaps
#20 | 2011-12-15Device for cooling integrated circuits
#21 | 2011-09-29Methods and systems for material bonding
#22 | 2011-04-21Method for fabricating through substrate vias
#23 | 2011-04-14Method for providing oxide layers
#24 | 2011-02-17Semiconductor package
#25 | 2011-02-03Method for insertion bonding and device thus obtained
#26 | 2011-01-13Method for aligning and bonding elements and a device comprising aligned and bonded elements
#27 | 2010-07-15Connecting Scheme for Orthogonal Assembly of Microstructures
#28 | 2009-12-31Connecting Scheme for Orthogonal Assembly of Microstructures
#29 | 2009-09-03Methods for bonding and micro-electronic devices produced according to such methods
#30 | 2008-09-18Device having a bonding structure for two elements
#31 | 2008-07-10Method for bonding a die or substrate to a carrier
#32 | 2008-07-03System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
#33 | 2008-02-21Method for forming packaged microelectronic devices and devices thus obtained
#34 | 2007-08-09Plurality of devices attached by solder bumps
#35 | 2007-03-29Methods for protecting metal surfaces
#36 | 2007-02-22Semiconductor device and method of producing the same
#37 | 2007-02-01Methods of bonding two semiconductor devices
#38 | 2006-12-28Methods for bonding and micro-electronic devices produced according to such methods
#39 | 2006-03-30Method for chip singulation
#40 | 2006-01-19Methods of bonding two semiconductor devices
#41 | 2005-06-21Method for producing electrical through hole interconnects and devices made thereof
#42 | 2005-04-05Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
#43 | 2005-01-06Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
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