Joy Watanabe

City:

Campbell, California

Country:

United States

Published Applications:

Last publication date:

2026-02-05

Top Assignees for applications by Joy Watanabe

The entities that hold a legal rights for patent applications filed by inventor Watanabe Joy:

Joy Watanabe from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

METHODS AND STRUCTURE FOR HYBRID BONDING

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Direct bonded stack structures for increased reliability and improved yield in microelectronics

InventorID:

2953056 ⎘