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Inventor profile of:

Stephen A. Murphy

City:

San Jose, California

Country:

United States

Published Applications:

6

Last publication date:

2014-09-18

Top Assignees for applications by Stephen A. Murphy

The entities that hold a legal rights for patent applications filed by inventor Murphy Stephen A.:

  • STATS CHIPPAC, LTD. 6 Singapore, Singapore
  • STATS ChipPAC Pte Ltd. 1 Singapore, Singapore

Recent patent applications by Murphy Stephen A.

Stephen A. Murphy from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-09-18
US20140264850A1
Electricity

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

#2 | 2012-10-18
US20120261817A1
Electricity

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

#3 | 2011-09-29
US20110233766A1
Electricity

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

#4 | 2010-05-13
US20100117230A1
Electricity

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

#5 | 2009-10-08
US20090250814A1
Electricity

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

#6 | 2009-02-05
US20090032975A1
Electricity

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

InventorID:

2957860 ⎘

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