Ken P. HACKENBERG

City:

Tempe, Arizona

Country:

United States

Published Applications:

Last publication date:

2019-08-29

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Ken P. HACKENBERG from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Multi-chip packages and sinterable paste for use with thermal interface materials

InventorID:

2981236 ⎘