BUBRYONG LEE

City:

CHNGCHEONGNAM-DO

Country:

South Korea

Published Applications:

Last publication date:

2021-07-22

Top Assignees for applications by BUBRYONG LEE

The entities that hold a legal rights for patent applications filed by inventor LEE BUBRYONG:

SAMSUNG ELECTRONICS CO., LTD. 1 Suwon-si, South Korea

Recent patent applications by LEE BUBRYONG

BUBRYONG LEE from CHNGCHEONGNAM-DO, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-07-22

US20210225829A1

Electricity

Method of manufacturing package-on-package device and bonding apparatus used therein

#2 | 2019-09-05

US20190273074A1

Electricity

Method of manufacturing package-on-package device and bonding apparatus used therein

InventorID:

2984447 ⎘