Chen-Yu WANG

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Chen-Yu WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Chen-Yu:

Chen-Yu WANG from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic package and method of manufacturing the same

CLAMP ASSEMBLY

FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Voltage converter circuit for converting AC voltage to DC voltage

Light-emitting device

InventorID:

2994707 ⎘