Bayan Lepas
Malaysia
5
2026-02-05
The entities that hold a legal rights for patent applications filed by inventor Phoon Hee Kong:
Hee Kong Phoon from Bayan Lepas, MY has applied for patents for these inventions. The list has both pending applications and granted patents:
Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
#2 | 2024-09-19Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
#3 | 2023-11-23Fabric die to fabric die interconnect for modularized integrated circuit devices
#4 | 2021-04-15Fabric die to fabric die interconnect for modularized integrated circuit devices
#5 | 2019-10-24Fabric die to fabric die interconnect for modularized integrated circuit devices
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