Jun MUKAWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2017-05-04

Top Assignees for applications by Jun MUKAWA

The entities that hold a legal rights for patent applications filed by inventor MUKAWA Jun:

Jun MUKAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART

RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART

PHOTOSENSITIVE COMPOSITION, CURED FILM AND ELECTRONIC PART

InventorID:

30321 ⎘